Auto BGA Rework Station mit Kamera (RW-SV550A)

Features:
1. Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen;
2. Optical vision system can move along with X/Y axis automatically; Easy or placement and operation;
3. Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550× 500mm;
4. Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
5. Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; With auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70× 70mm;
6. Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; Can analyze the five practically-tested profiles, and compare them with the history saved profiles; With USB for connecting mouse and updating software;
7. Color LCD monitor; Big size screen, easy to operate;
8. Built-in vacuum pump; The max suction up to 80g; 60 ° Rotation in φ Angle,
9. 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;
10. Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
11. Auto pick up chip, auto solder, auto remove, auto placement;
12. Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
13. Visible monitoring system, can view the melting procee of the balls, (optional).