Multi-Layer Communication PCB

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Modell Nr.: 6PXMDI16066
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Shengyi, Kb, Nanya, Ilm
• Kriterien: aql ii 0,65
• Lochgrößen: 0,25mm
• Abgeflachte Kante: ja
• Impedanz: 50/90/100 Ohm
• Trace Width(Min.): 0.069mm/0.076mm
• Surfc-Behandlung: enig
• Transportpaket: Vacuum Packaging
• Spezifikation: 180*200mm
• Warenzeichen: XMANDA
• Herkunft: Made in China
• HS-Code: 8534009000
• Produktionskapazität: 50000sqm/Month

Produktbeschreibung

Specifications:

Layers:6
Thickness:1.6mm
Material: FR-4 
Size:180*200mm
Surface treatment: ENIG
Line width/spacing:0.102/0.116mm
Minimum aperture:0.3mm
Solder mask color:Green
Finished copper thickness: 1/1 OZ

 

 

 

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.
2. Made of TG140/150/170 material

Shenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthly
One-stop solutions for clients (PCB & PCBA)
Over 12 years of Experience in PCBs
Avg Response time: ≤24 h (experienced Engineers to Serve you)
Comply with RoHS,TS16949,ISO9001 and UL certifications.
Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

 

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.

High-quality Raw Material
★Traceable source of branded raw material
★Standardized procurement process
★Strict supplier selection policy

Production Equipment
★High precision processing equipment
★Efficient operation guarantees quality
★Meet various special technical processes

Intelligent System
★Intelligent audition
★Intelligent CAM
★Intelligent paneling
★Intelligent production

Strict Inspection
★100% AOI testing
★100% FQA/FQC
★Quality Control
★'Failed One Lost Ten'
 

Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.