• Smart Cash Register with HDI Circuit Board
  • Smart Cash Register with HDI Circuit Board
  • Smart Cash Register with HDI Circuit Board
  • Smart Cash Register with HDI Circuit Board
  • Smart Cash Register with HDI Circuit Board
  • Smart Cash Register with HDI Circuit Board
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Smart Cash Register with HDI Circuit Board

Art: Starre Leiterplatten
Dielektrikum: FR-4
Material: Fiberglas Epoxy
Anwendung: Computer
Flammhemmenden Eigenschaften: V0
Mechanische Rigid: Starr

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Diamond-Mitglied Seit 2023

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Grundlegende Informationen.

Modell Nr.
32156485
Aufbereitungstechnik
Elektrolytische Folie
Grundmaterial
Kupfer
Dämmstoffe
Epoxidharz
Marke
Shengyi, Kb, Nanya, Ilm
Kriterien
aql ii 0,65
Lochgrößen
0,25mm
Abgeflachte Kante
ja
Impedanz
50/90/100 Ohm
Kurvenbreite (min.)
0,069mm/0,076mm
Surfc-Behandlung
enig
Transportpaket
Vacuum Packaging
Spezifikation
100*40mm
Warenzeichen
XMANDA
Herkunft
Made in China
HS-Code
8534009000
Produktionskapazität
50000sqm/Month

Produktbeschreibung

Smart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit Board


Specifications:

Layers: 10
Thickness:0.8mm
Material: FR-4 
Size:100*40mm
Surface treatment: ENIG
Line width/spacing(inner):0.005mm/0.005mm
mm
Line width/spacing(outer):0.076mm/0.076mm
Minimum aperture:0.2mmSolder mask color: Black
Finished copper thickness: 1/1 OZ
Smart Cash Register with HDI Circuit Board

 

Smart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit BoardSmart Cash Register with HDI Circuit Board
 

Smart Cash Register with HDI Circuit Board
Smart Cash Register with HDI Circuit Board
Smart Cash Register with HDI Circuit Board
Smart Cash Register with HDI Circuit Board
 
Smart Cash Register with HDI Circuit Board
Smart Cash Register with HDI Circuit Board
Smart Cash Register with HDI Circuit Board

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.
2. Made of TG140-150-170 material


Shenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthly
One-stop solutions for clients (PCB & PCBA)
Over 12 years of Experience in PCBs
Avg Response time: ≤24 h (experienced Engineers to Serve you)
Comply with RoHS,TS16949,ISO9001 and UL certifications.
Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

 

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.

High-quality Raw Material

★Traceable source of branded raw material
★Standardized procurement process
★Strict supplier selection policy

Production Equipment
★High precision processing equipment
★Efficient operation guarantees quality
★Meet various special technical processes

Intelligent System
★Intelligent audition
★Intelligent CAM
★Intelligent paneling
★Intelligent production

Strict Inspection
★100% AOI testing
★100% FQA/FQC
★Quality Control
★'Failed One Lost Ten'

 
Our Capabilities and Technology
Items 2022 2023
Layers (MP):22layer,(Sampling):32 layer (MP):32layer
Max. Board THK Sampling 4.0mm / MP :3.2mm Sampling 5.0mm / MP:3.2mm
Min. Board THK Sampling :0.4mm /MP :0.5mm Sampling: 0.3mm / MP:0.4mm
Base copper Inner layer 1/3 ~ 6OZ 1/3~8 OZ
Outer layer 1/3 ~ 6 OZ 1/3 ~ 8 OZ
Borehole diameter Min.PTH 0.2mm 0.15mm
Max. aspect ratio 10:01 12:01
HDI aspect ratio 0.8:1 1:01
Tolerances   PTH ±0.076mm ±0.05mm
  NPTH ±0.05mm ±0.03mm
Solder mask opening 0.05mm 0.03mm
Solder dam (Green) 0.076mm , (Green) 0.076mm ,
(other color) 0.1mm (other color) 0.08mm
Min. core THK. 0.1mm 0.08mm
Bow&twist ≤0.5% ≤0.5%
Routing Tol.  Sampling :±0.075mm /MP:±0.1mm Sampling:±0.075mm /MP:±0.075mm
Impedance Tol. ±10% ±8%
Min. w/s (Inner layer) 0.075 / 0.075mm 0.075 / 0.075mm
Min. w/s (Outer layer) 0.075 / 0.075mm 0.075 / 0.075mm
 (Min. BGA size) 0.2mm 0.15mm
(pitch)(Min. BGA Pitch) 0.65mm 0.5mm
(Working panel size) 600mm*700mm 600mm*700mm
Special process Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. 



 

 

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